Laser Processing
The ongoing demand for miniaturization, production efficiency and low cost electronics, continuously
requires the development of industrially viable, precise, and efficient micromachining processes with high resolution.
Initially adopted as a more agile and rapid alternative to conventional technologies, laser micromachining is increasingly
central to production of the next-generation of today’s fastest-growing new technologies. Laser micromachining is
displacing conventional technologies not only because it is simpler, cheaper and faster, but also because it is proving
able to create the complex, detailed microstructures that conventional micromachining techniques are unable to provide.
Laser micromachining is typically performed by one of two methods: Excimer or Solid State.
Excimer lasers can be used to micromachine, anneal and debond. For micromachining, Excimer laser systems use a mask
in a similar way to photolithography. This produces superior laser process edge quality and throughput, and can handle
complex patterns cleanly with minimal thermal effects. Excimer ablation is best described as photochemically initiated electron
excitation leading to a sudden increase in pressure which results in a material explosive removal into monomers and gases
known as ablation. These systems are ideal for precisely machined parts and best suited for high volume applications
that require many repeated parts.
DPSS (Diode Pumped Solid State) laser use a direct write method, which provides faster setup and easy integration to CAM systems.
Solid State laser systems, when packaged and integrated with laser workstations, can be used to drill, cut, structure and anneal
many types of materials to create highly defined vias and structures. These systems are most ideal for applications where high edge
quality is not as critical or removal of specific materials is not suitable for Excimer laser processing.
