Creating dense arrays of fine features in polyimide substrates can be very time consuming when using steered focused beam laser ablation systems.
Tamarack’s large beam projection laser ablation technology dramatically reduces ablation time while also increasing resolution capability and pattern placement accuracy. In addition, the process provides good material removal selectivity and generates little or no heat to the surrounding areas.
High power excimer lasers and projection lenses provide the ability to generate holes as small as 1 micron diameter. A mask similar to a semiconductor reticle determines the pattern to be produced. It allows generation of complex shapes, and provides the ability to change patterns by simply replacing the mask.
These tools are proven technology enablers for the volume manufacture of products such as: Ink jet nozzle arrays, Semiconductor packaging microvias and Medical devices.
Three platforms are available, based on specific application requirements. These systems are equiped with automatic material handling, automatic pattern recognition based alignment, and data logging.
Options including side wall shaping and lenses from 1:1 to 1:20 reduction are available.
