Typical Applications:

DPSS Lasers (Nano & Pico):

DPSS lasers offer a variety of unique micromachining and finishing
capabilities, enabling precision and low cost manufacturing of many types
of devices and materials. We specialize in the manufactureof complete
laser processing systems, handling everything from silicon wafers to
polymer web materialswith complex geometries and alignment tolerances.
Our vertically integrated manufacturing processesmake us your single source
solution for the most challenging of projects, from R&D to complete automated systems.

Picosecond Lasers:

These ultra-short pulse lasers offer a new quality in laser micro-machining
by cold ablation, a cold removal of very thin material layers,nearly without
any thermal side-effects like burrs and micro-cracks. These ps-lasers allow
the ability to micro-structure any material,even materials that are very difficult
to process by mechanical means or require . Industrial ps-lasers are used for
micro-structuring surfaces, to micro-cut and micro drill thin materials up to
a few millimeters thickness with aspect ratios up to 1 to 10.

		Wavelengths include: 266nm 355nm 532nm 1064nm

Benefits of picosecond laser processing

• create features sized down to 2µm and control depth to within 10nm
  

• eliminate the heat affected zone
  

• process virtually any material in with selectable wavelengths

• increase throughput due to high pulse repetition rates
  

• lower total cost of ownership