Processing Methods

Processing Methods

Tamarack Scientific manufactures a range of laser processing and photolithography systems for ablating, exposing, annealing and/or de-bonding a wide variety of materials. 

Laser Ablate

Laser ablation is the process of removing material from a surface by irradiating it with a laser beam, which heats the material and sublimates or evaporates the surface layers in a controlled manner. Tamarack’s laser systems ablate micro vias, trenches, pockets, scribes, patterns and full cuts utilizing Excimer and Solid State lasers.  With their large output beam and high UV power, excimer lasers (308 & 248nm)  are ideally suited for ablating dense and/or intricate patterns. With their small directed beam, solid state lasers (266, 355, 532 and 1064nm)   are best suited for ablating low volumes of material such as scribes, cuts and sparsely populated vias.

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Expose

Depending upon the process requirements, Tamarack Scientific’s exposure systems utilize a high-power mercury arc lamp, an excimer laser or a solid state laser for masked or maskless, projection or contact proximity. Tamarack’s projection optics with large DOF allow for processing thick resists with high aspect ratios without substrate contact.
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De-bond

Laser de-bonding involves the laser lift-off (LLO) of layers of material to change the thermal and/or electrical properties of a substrate and/or adhesive layer. Tamarack provides de-bonding solutions which utilize excimer or solid state lasers.  

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Anneal

Annealing occurs by the diffusion of atoms within a solid material, which redistributes and destroys the dislocations in materials such as metals and ceramics.  The result is an increase in the ductility of the material. Tamarack provides annealing systems which utilize excimer or solid state lasers.

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