Wafer Bumping/Advanced Packaging

Flip chip configurations are entering the main stream of electronic packaging at
an increasing rate. The trend is for higher density I/O chips being produced on larger, 300 mm wafers. For fine line pitch applications, photolithography is used to define the bump mask. Until recently, achieving higher yields and increased productivity simultaneously proved to be a difficult task.

Tamarack introduces two different UV exposure tools that minimize this tradeoff:

• · Model 252 Proximity Aligner
  
• · Model 336 Projection Scanner
  

Proximity aligners provide highly collimated illumination and a precisely adjustable proximity gap for accurate exposure control.

Projection scanners provide the flexibility of a large depth of focus lens and high irradiance with the throughput of a full field exposure machine. Selectable illumination wavelengths allow the system to match the specific photoresist characteristics.

Both tools are designed for 24/7 operation, and accurate imaging and alignment in ultrathick photoresist. Available with full automation (including FOUPS) for wafer sizes up to 300 mm.

The choice is yours: the economical proximity aligner, or the high preformance full field projection scanner. Select one of the links below for product specific information, or contact Tamarack for help in matching your process to the appropriate tool.