Printed Circuit Boards

PCB Manufacturing technology is constantly pushing for higher density interconnect boards. The demand for finer lines and spaces requires exposure systems with improved registration and alignment capabilities in order to maintain high yields.

Tamarack’s highly collimated UV exposure systems provide the highest resolution obtainable in a contact exposure system, with resolution capabilities below 1 mil lines and spaces in standard dry film resist. Tamarack’s collimated exposure systems are unique, in that they provide accurate pattern replication over the entire exposure area, making them ideal for back panels as well. Panel to artwork alignment and artwork to artwork repeatability within +/- 5 um provides the necessary performance for critical Soldermask and Outerlayer imaging.

Tamarack’s collimated exposure systems were introduced over 20 years ago with a majority of these original tools still reliably imaging products that meet and exceed today’s technology demands. Does your current photolithography equipment provide the yields necessary to keep your product competitive?


Home | About | Products | Applications | Library | Careers | Contact | Site Map

Copyright © 2004, Tamarack Scientific Co., Inc.