Advanced Packaging & 3D Interconnect
With recent market expansion in the area of portable electronics such as smartphones, MP3 players, game consoles, and network communications devices, manufacturers have been competing to provide timely solutions for smaller, better integrated electronic packages that maintain high speed, peak performance, reliability and appropriate scale at a reasonably low cost of production.
To pace consumer demand and address cost factors, manufacturers have progressed advanced packaging and 3-D integration (3D stacking, 3D interconnect) techniques to produce chips that possess the reliability, speed, pitch, and pin count necessary for optimal performance. With recent advances in packaging methods, interconnects can be produced at a lower cost, with lower power consumption, small form factor, higher performance, and increased yield and reliability. Three-dimensional integration uses stacked integrated circuits connected with multiple vertical layers of transistors to improve performance, instead of the single layer of transistors heretofore used by 2D integrated circuits. The goal of 3D technology is to provide higher transistor density, faster interconnects and heterogeneous technology integration, which meets the desired results of lower power usage, lower cost and faster time to market.
By 2012, the number of 3D IC-processed wafers is predicted to exceed 10 million units, in large part driven by handset, wireless and computing applications (Yole Développement, 2010). As the trend continues to shift toward 3D integration technology, microfabrication and packaging, manufacturers are challenged with keeping pace with rapid market growth.
In response to this trend, advanced IC packaging techniques are undergoing significant changes in areas such as flip chip and wafer-level packages (WLPs), 3D TSV, chip scale packages (CSPs) and systems-in-package (SiPs). Tamarack Scientific is uniquely poised to assist the varied requirements of the industry with its line of laser processing and photolithography systems. Tamarack’s projection scanning systems are fully-automated tools designed for the high-throughput, high resolution exposure of 200mm and 300mm advanced packaging applications. Tamarack’s excimer & solid state laser systems are ideal for ablating patterns, drilling vias, cutting/scribing, annealing and/or de-bonding substrates. With resolution down to 2 um and sub-micron alignment accuracy, these tools provide high throughput with outstanding precision, while maintaining a low total cost of ownership.
Product links:
- M336 300mm Projection Scanner – for exposing
- M420 Series of Excimer Laser Steppers – for ablating & exposing
- M440 Series of Excimer Line Beam Systems – for annealing and debonding
- M800 Series of Solid State Laser Systems – for ablating & exposing
- M152 Mask Aligner – for exposing
Please contact one of our knowledgeable sales engineers for more information on how we can help you optimize your advanced packaging application.