High Density Interconnects

High density interconnects have become the enabling technology for the next generation of small portable electronic devices. As this technology continues toward higher feature densities, many of what were yesterday’s adequate imaging tools just won’t provide acceptable yields. The challenges are multifaceted, from unstable substrates, to ultra-fine features, and much tighter layer to layer overlay requirements.

Recognizing that HDI design and fabrication is rooted on many technologies, Tamarack offers a variety of world class exposure tools that address specific manufacturing issues. They are designed to optimize the throughput and yield tradeoff, providing the lowest possible cost of ownership. These systems include:

· Collimated light contact exposure printers, for applications requiring 1:1 or better aspect ratios in dry film or other robust photoresist.

· Collimated light proximity aligners for imaging up to 450mm x450mm in proximity or vacuum contact modes. Manual to fully automatic systems including reel to reel are available.

· Projection scanners for relatively stable or dimensionally predictable substrates, and resolution requirements down to 4 microns. Global alignment accuracy of +/- 2 microns can be provided.

· Projection steppers, for applications where substrates exhibit unpredictable dimensional changes through processing, coupled with requirements for ultra-fine line resolution (down to 6 microns) and alignment requirements in the +/-5 microns range.

Tamarack’s UV exposure systems have been created to meet your customers needs for today and tomorrow. Please select one of the links below for product specific information.